Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions
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! | ! | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|E-beam evaporator Temescal]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|E-beam evaporator (Temescal)]] and [[Specific Process Knowledge/Thin film deposition/10-pocket e-beam evaporator|E-beam evaporator (10-pockets)]]) | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
! Sputter ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | ! Sputter ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | ||
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! Pre-clean | ! Pre-clean | ||
|Ar ion | |Ar ion etch (only in E-beam evaporator Temescal) | ||
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|RF Ar clean | |RF Ar clean | ||
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|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
! Deposition rate | ! Deposition rate | ||
|0.5-10 Å/s | |0.5-10 Å/s (in 10-pocket machine only up to 5 Å/s as material is deposited from a liner) | ||
|1-10 Å/s | |1-10 Å/s | ||
|Depends on process parameters, 1-10 Å/s | |Depends on process parameters, 1-10 Å/s | ||
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*See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet] | |||
*See | |||
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* Silicon oxide | * Silicon oxide | ||