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In the page about [[Specific Process Knowledge/Thin film deposition/Lesker/Stress dependence on sputter parameters in the Lesker sputter system|stress dependence on sputter parameters for Si, Ni, and Cu]] you can read some recommendations about which sputter parameters led to which stress characteristics in specific materials.
In the page about [[Specific Process Knowledge/Thin film deposition/Lesker/Stress dependence on sputter parameters in the Lesker sputter system|stress dependence on sputter parameters for Si, Ni, and Cu]] you can read some recommendations about which sputter parameters led to which stress characteristics in specific materials.


This page aims to give more general information about the origin of stress in thin films. It appears that the following is a good rule of thumb
This page aims to give more general information about the origin of stress in thin films. It appears that the following is a good rule of thumb, though it does not completely match the concrete observations for the sputtered films referred to above:
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