Specific Process Knowledge/Thin film deposition/Temescal: Difference between revisions

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 [[File:Temescal.JPG|400px|right|thumb|The Temescal E-beam evaporator in cleanroom A-5]]
-The Temescal is a system for depositing metals by electron-beam evaporation. In e-beam evaporation, the deposition is line-of-sight directed from the source, which means it will coat only the surface of the sample facing directly towards the source. This makes it very useful for example for metals for lift-off. The system also has an ion source for in-situ Argon sputtering that can be used either for cleaning samples prior to deposition or to modify the film during deposition.
+The E-beam evaporator (Temescal) is a system for depositing metals by electron-beam evaporation. In e-beam evaporation, the deposition is line-of-sight directed from the source, which means it will coat only the surface of the sample facing directly towards the source. This makes it very useful for example for [[Specific Process Knowledge/Lithography/LiftOff|lift-off]]. This particular machine is made by Temescal, a division of FerroTec, and was purchased by Nanolab in 2018. It is very similar to the newer e-beam evaporator we have from the same manufacturer, bought in 2023, which we call [[Specific Process Knowledge/Thin film deposition/10-pocket_e-beam_evaporator|E-beam Evaporator (10-pockets)]] in the LabManager system.
-Wafers are loaded into the top of the chamber, which acts as a loadlock as it can be separated from the rest of the chamber by a large gate valve. Deposition will happen on all samples that are loaded together. You can load up to four 6" wafers or three 8" wafers for deposition on surfaces facing the evaporation source, or on up to one 6" wafer for tilted deposition. By using sample holder inserts, you can deposit metals on samples of different sizes and shapes. Only one metal can be deposited at a time, but you can deposit many layers of different metals one after the other. The system contains 6 metals at a time and the metals are exchanged based on user requests, so please request the metals you wish well in advance.
+A special feature of the older machine - the E-beam evaporator (Temescal) - is that it has an ion source for in-situ Argon sputtering that can be used either for cleaning samples prior to deposition or to modify the film during deposition.
+In both Temescal e-beam evaporators, wafers are loaded into the top of the chamber, which acts as a loadlock as it can be separated from the rest of the chamber by a large gate valve. Deposition will happen on all samples that are loaded together. You can load up to four 6" wafers or three 8" wafers for deposition on surfaces facing the evaporation source, or on up to one 6" wafer for tilted deposition. By using sample holder inserts, you can deposit metals on samples of different sizes and shapes. Only one metal can be deposited at a time, but you can deposit many layers of different metals one after the other. The system contains 6 metals at a time and the metals are exchanged based on user requests, so please request the metals you wish well in advance.
 '''The user manual, user APV, and contact information can be found in LabManager:'''
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 <!-- give the link to the equipment info page in LabManager: -->
-[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=429 E Beam Evaporator (Temescal) in LabManager]
+[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=429 E Beam Evaporator (Temescal) in LabManager]
 '''Training videos may be found here:'''