Specific Process Knowledge/Thin film deposition: Difference between revisions
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*[[/Wordentec|Wordentec]] - ''E-beam evaporator, sputter and thermal evaporator'' | *[[/Wordentec|Wordentec]] - ''E-beam evaporator, sputter and thermal evaporator'' | ||
*[[/thermalevaporator|Thermal evaporator]] | *[[/thermalevaporator|Thermal evaporator]] | ||
*[[/Temescal|E Beam Evaporator (Temescal)]] | *[[/Temescal|E-Beam Evaporator (Temescal)]] | ||
*[[/10-pocket e-beam evaporator|E-Beam Evaporator (10 pockets)]] | |||
*[[/Sputter coater#Sputter_coater_03_(Cressington)|Sputter coater 03]] - ''Gold sputtering system'' | *[[/Sputter coater#Sputter_coater_03_(Cressington)|Sputter coater 03]] - ''Gold sputtering system'' | ||
*[[/Sputter coater#Sputter_coater_04_(Agar Scientific)|Sputter coater 04]] - ''Gold sputtering system'' | *[[/Sputter coater#Sputter_coater_04_(Agar Scientific)|Sputter coater 04]] - ''Gold sputtering system'' |
Revision as of 11:24, 11 January 2024
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Choose material to deposit
Semiconductors | Oxides | Nitrides | Carbon and Carbides | Metals | Alloys | Transparent conductive oxides | Polymers | Multilayers |
Aluminium Oxide (Al2O3)
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Silicon Nitride - and oxynitride
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Carbon
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Aluminium
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AlCu And an electroceramic: YSZ (Yttrium stabilized zirconia) |
ITO (Tin doped Indium Oxide) |
SU-8 |
Oh no! My material is not on the list! Please contact the Thin Film group if you would like to inquire about a material that is not mentioned here.
Choose deposition equipment
PVD - Physical vapor deposition | LPCVD - low pressure chemical vapor deposition | PECVD - plasma enhanced chemical vapor deposition | ALD - atomic layer deposition | Coaters - for polymers | Others
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See the Lithography/Coaters page for coating polymers |
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