Specific Process Knowledge/Thermal Process/Oxidation: Difference between revisions
| Line 59: | Line 59: | ||
! | ! | ||
[[Specific_Process_Knowledge/Thermal_Process/Furnace_Noble|Multipurpose Annealing furnace]] | [[Specific_Process_Knowledge/Thermal_Process/Furnace_Noble|Multipurpose Annealing furnace]] | ||
! | |||
[[Specific_Process_Knowledge/Thermal_Process/RTP Annealsys| RTP Annealsys (research tool)]] | |||
|- | |- | ||
| Line 70: | Line 72: | ||
|Dry and wet oxidation and annealing of wafers from Wafer Bonder 02 and from PECVD4 and PECVD3. | |Dry and wet oxidation and annealing of wafers from Wafer Bonder 02 and from PECVD4 and PECVD3. | ||
|Dry oxidation and annealing of almost all materials. | |Dry oxidation and annealing of almost all materials. | ||
|Rapid thermal processing: RTA (annealing), RTO (oxidation), RTN (nitridation) and RTH (hydrogenation). | |||
|- | |- | ||
| Line 89: | Line 92: | ||
*Dry: O<sub>2</sub> | *Dry: O<sub>2</sub> | ||
*Wet: Bubbler | *Wet: Bubbler | ||
| | |||
*Dry: O<sub>2</sub> | |||
| | | | ||
*Dry: O<sub>2</sub> | *Dry: O<sub>2</sub> | ||