Jump to content

Specific Process Knowledge/Thermal Process/Annealing: Difference between revisions

Indiogo (talk | contribs)
Indiogo (talk | contribs)
Line 38: Line 38:
|Annealing of wafers with Al and ALD deposited AL2O3 and TiO2.
|Annealing of wafers with Al and ALD deposited AL2O3 and TiO2.
|Rapid thermal processing, usually, annealing (RTA).
|Rapid thermal processing, usually, annealing (RTA).
|Annealing, oxidation and resist pyrolysis of different samples
|Annealing, oxidation and resist pyrolysis of different samples.
|Rapid thermal processing: RTA (Annealing), RTO (Oxidation), RTN (Nitridation).
|-
|-