Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch: Difference between revisions
No edit summary |
No edit summary |
||
Line 76: | Line 76: | ||
*[[Specific Process Knowledge/Etch/ICP Metal Etcher|ICP Metal Etch nanoetch]] | *[[Specific Process Knowledge/Etch/ICP Metal Etcher|ICP Metal Etch nanoetch]] | ||
The nanoetch | The nanoetch |
Revision as of 09:35, 28 March 2011
Recipe | nano1.0 | |||||||
---|---|---|---|---|---|---|---|---|
Tool | Pegasus | |||||||
C4F8 (sccm) | 52 | |||||||
SF6 (sccm) | 38 | |||||||
O2 (sccm) | 0 | |||||||
Coil power (W) | 800 (forward) | |||||||
Platen power (W) | 50 | |||||||
Pressure (mtorr) | 4 | |||||||
Process time (s) | 120 | |||||||
Nominal line width | Etched depths (nm) | |||||||
30 nm | ||||||||
60 nm | ||||||||
90 nm | ||||||||
120 nm | ||||||||
150 nm | ||||||||
Nominal line width | Etch rates in trenches (nm/min) | |||||||
30 nm | ||||||||
60 nm | ||||||||
90 nm | ||||||||
120 nm | ||||||||
150 nm | ||||||||
Etch rates in zep resist (nm/min) | ||||||||
zep | ||||||||
Images | Images |
The nanoetch