Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch: Difference between revisions
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*[[Specific Process Knowledge/Etch/ICP Metal Etcher|ICP Metal Etch nanoetch]] | *[[Specific Process Knowledge/Etch/ICP Metal Etcher|ICP Metal Etch nanoetch]] | ||
The nanoetch | The nanoetch | ||
Revision as of 09:35, 28 March 2011
| Recipe | nano1.0 | |||||||
|---|---|---|---|---|---|---|---|---|
| Tool | Pegasus | |||||||
| C4F8 (sccm) | 52 | |||||||
| SF6 (sccm) | 38 | |||||||
| O2 (sccm) | 0 | |||||||
| Coil power (W) | 800 (forward) | |||||||
| Platen power (W) | 50 | |||||||
| Pressure (mtorr) | 4 | |||||||
| Process time (s) | 120 | |||||||
| Nominal line width | Etched depths (nm) | |||||||
| 30 nm | ||||||||
| 60 nm | ||||||||
| 90 nm | ||||||||
| 120 nm | ||||||||
| 150 nm | ||||||||
| Nominal line width | Etch rates in trenches (nm/min) | |||||||
| 30 nm | ||||||||
| 60 nm | ||||||||
| 90 nm | ||||||||
| 120 nm | ||||||||
| 150 nm | ||||||||
| Etch rates in zep resist (nm/min) | ||||||||
| zep | ||||||||
| Images | Images | |||||||
The nanoetch