Specific Process Knowledge/Lithography/EBeamLithography/JEOLPatternPreparation: Difference between revisions
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Some steps are done using Beamer from GenISys GmbH. We advise all users to familiarise themselves with Beamer [https://www.genisys-gmbh.com/webinar-series-beamer-training.html through the tutorial series found on GenISys own website.] or from our own [[Specific_Process_Knowledge/Lithography/EBeamLithography/BEAMER|Beamer guide.]] | Some steps are done using Beamer from GenISys GmbH. We advise all users to familiarise themselves with Beamer [https://www.genisys-gmbh.com/webinar-series-beamer-training.html through the tutorial series found on GenISys own website.] or from our own [[Specific_Process_Knowledge/Lithography/EBeamLithography/BEAMER|Beamer guide.]] | ||
Please observe that | Please observe that wafers are clamped in such a way that it is not possible to expose the rim of the wafer. The patternable diameter for wafers are as listed below. Writing a pattern outside this area does not damage the tool but it is a waste of time. | ||
*2": 44 mm | *2": 44 mm | ||
*4": 93 mm | *4": 93 mm | ||