Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch: Difference between revisions
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!O<sub>2</sub> (sccm) | !O<sub>2</sub> (sccm) | ||
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Revision as of 10:43, 22 March 2011
Recipe | nano1 | |||||||
---|---|---|---|---|---|---|---|---|
Tool | Pegasus | |||||||
C4F8 (sccm) | 52 | |||||||
SF6 (sccm) | 38 | |||||||
O2 (sccm) | 0 | |||||||
Coil power (W) | 800 (forward) | |||||||
Platen power (W) | 50 | |||||||
Pressure (mtorr) | 4 | |||||||
Process time (s) | 120 | |||||||
Nominal line width | Etched depths (nm) | |||||||
30 nm | ||||||||
60 nm | ||||||||
90 nm | ||||||||
120 nm | ||||||||
150 nm | ||||||||
Nominal line width | Etch rates in trenches (nm/min) | |||||||
30 nm | ||||||||
60 nm | ||||||||
90 nm | ||||||||
120 nm | ||||||||
150 nm | ||||||||
Etch rates in zep resist (nm/min) | ||||||||
zep |