Specific Process Knowledge/Thin film deposition/Deposition of Scandium Nitride: Difference between revisions

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The only tool for this application is the Cluster-based multi-chamber high vacuum sputtering deposition system, commonly referred to as the 'Cluster Lesker.' The operating process is thoroughly documented and described in detail.:
The only tool for this application is the Cluster-based multi-chamber high vacuum sputtering deposition system, commonly referred to as the 'Cluster Lesker.' The operating process is thoroughly documented and described in detail.:


* [[Specific Process Knowledge/Thin film deposition/Deposition of Scandium Nitride/ScN Reactive RF Sputtering in Cluster Lesker PC3|Deposition of Scandium Nitride (Sc) using reactive sputtering]] in Sputter-System Metal-Nitride(PC3) Source 1 (4-inch target)
* [[Specific Process Knowledge/Thin film deposition/Deposition of Scandium Nitride/ScN Reactive Sputtering in Cluster Lesker PC3|Deposition of Scandium Nitride (Sc) using reactive sputtering]] in Sputter-System Metal-Nitride(PC3) Source 1 (4-inch target)


At the moment (October 2023) we have a 4-inch Sc target (0.250" thick bonded to Cu) for PC3 Src1.
At the moment (October 2023) we have a 4-inch Sc target (0.250" thick bonded to Cu) for PC3 Src1.

Revision as of 12:00, 9 November 2023

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Deposition of Scandium Nitride

Deposition of ScN can only be done by reactive sputtering using Sc target.

The only tool for this application is the Cluster-based multi-chamber high vacuum sputtering deposition system, commonly referred to as the 'Cluster Lesker.' The operating process is thoroughly documented and described in detail.:

At the moment (October 2023) we have a 4-inch Sc target (0.250" thick bonded to Cu) for PC3 Src1.

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