Specific Process Knowledge/Thin film deposition: Difference between revisions
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[[/Deposition of Niobium Titanium Nitride| Niobium Titanium Nitride]] - ''superconductors''<br/> | [[/Deposition of Niobium Titanium Nitride| Niobium Titanium Nitride]] - ''superconductors''<br/> | ||
[[/Deposition of Aluminium Nitride| Aluminum Nitride (Al<sub>x</sub>N<sub>y</sub>)]]<br/> | [[/Deposition of Aluminium Nitride| Aluminum Nitride (Al<sub>x</sub>N<sub>y</sub>)]]<br/> | ||
[[/Deposition of Scandium Nitride| Scandium Nitride (Sc<sub>x</sub>N<sub>y</sub>)]]<br/> | |||
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[[/Deposition of Tungsten|Tungsten]]<br/> | [[/Deposition of Tungsten|Tungsten]]<br/> | ||
[[/Deposition of Zinc|Zinc]]<br/> | [[/Deposition of Zinc|Zinc]]<br/> | ||
[[/Deposition of Scandium|Scandium]]<br/> | |||
Revision as of 11:40, 9 November 2023
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Choose material to deposit
| Semiconductors | Oxides | Nitrides | Carbon and Carbides | Metals | Alloys | Transparent conductive oxides | Polymers | Multilayers |
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Aluminium Oxide (Al2O3)
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Silicon Nitride - and oxynitride
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Carbon
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Aluminium
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AlCu And an electroceramic: YSZ (Yttrium stabilized zirconia) |
ITO (Tin doped Indium Oxide) |
SU-8 |
Oh no! My material is not on the list! Please contact the Thin Film group if you would like to inquire about a material that is not mentioned here.
Choose deposition equipment
| PVD - Physical vapor deposition | LPCVD - low pressure chemical vapor deposition | PECVD - plasma enhanced chemical vapor deposition | ALD - atomic layer deposition | Coaters - for polymers | Others
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See the Lithography/Coaters page for coating polymers |
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