Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-4/SiO2 Etch/Cr mask: Difference between revisions
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**CD loss due to larger mask faceting | **CD loss due to larger mask faceting | ||
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*Sidewall | *Sidewall passivation↑ | ||
**Sample | **Sample size↓ | ||
**Platen | **Platen power↓ | ||
**Coil | **Coil power↓ | ||
**H2 | **H2 flow↑ | ||
**O2 | **O2 flow↓ | ||
**Total gas flow rate/ | **Total gas flow rate/pressure↑ | ||
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