Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-4/SiO2 Etch/Cr mask: Difference between revisions
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***Reduced the CD (Critical Dimensions) | ***Reduced the CD (Critical Dimensions) | ||
*Coil power: Reducing coil power | *Coil power: Reducing coil power | ||
**CD | **less CD loss | ||
**more sidewall passivation | **more sidewall passivation | ||
*Increasing process time: | *Increasing process time: | ||