Jump to content

Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-4/SiO2 Etch/Cr mask: Difference between revisions

Bghe (talk | contribs)
No edit summary
Bghe (talk | contribs)
No edit summary
Line 131: Line 131:
File:C10110_04.jpg
File:C10110_04.jpg
File:C10110_06.jpg
File:C10110_06.jpg
File:C10110_08.jpg
File:C10110_08.jpg |pitch 800 nm <br> Top 661 nm <br> @edge 437 nm <br> bottom 402 nm <br> height 916 nm <br> height from edge 827 nm <br> Cr left 83.5 nm <br> selectivity 55.5
File:C10110_10.jpg
File:C10110_10.jpg
File:C10110_12.jpg
File:C10110_12.jpg