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Specific Process Knowledge/Thin film deposition/Lesker: Difference between revisions

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Line 123: Line 123:
|-
|-
|Au||   0,125"|| 99,999% || 314 || 20
|Au||   0,125"|| 99,999% || 314 || 20
|-
|Co|| 0,0625"|| 99,95% || 126 || 10
|-
|-
|Cr||   0,125"|| 99,95% || 251 || 20
|Cr||   0,125"|| 99,95% || 251 || 20
Line 161: Line 159:
|-
|-
|Al/Cu99,5/0,5%||   0,250"|| 99,99% || 314 || 20
|Al/Cu99,5/0,5%||   0,250"|| 99,99% || 314 || 20
|-
|Co/Fe  50/50%||   0,0625"|| 99,95% || 126 || 10
|-
|Co/Fe  80/20%||   0,0625"|| 99,95% || 126 || 10
|-
|Co/Fe  90/10%||   0,0625"|| 99,95% || 126 || 10
|-
|-
|Cr2O3||   0,125" + Cu backing plate|| 99,8% || 63 || 0.5
|Cr2O3||   0,125" + Cu backing plate|| 99,8% || 63 || 0.5
Line 181: Line 173:
|-
|-
|Ni/Co50/50%|| 0,0625"|| 99,95% || 126 || 20
|Ni/Co50/50%|| 0,0625"|| 99,95% || 126 || 20
|-
|Ni/Co  50/50%|| 0,125"|| 99,95% || 126 || 20
|-
|-
|Ni/Fe    80/20%|| 0.125"|| 99,95% || 126 || 20
|Ni/Fe    80/20%|| 0.125"|| 99,95% || 126 || 20
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