Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-4/SiO2 Etch: Difference between revisions
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Using the electromagnetic coil on the recipe SiO2_res_10 gave higher etch rate on this chip that was placed in the center of a 6" wafer. The Etch profile is more angles. | Using the electromagnetic coil on the recipe SiO2_res_10 gave higher etch rate on this chip that was placed in the center of a 6" wafer. The Etch profile is more angles. | ||
*I few more test with resist mask and electromagnets can be found here: [[/EM with resist mask]] | *I few more test with resist mask and electromagnets can be found here: [[/EM with resist mask|EM with resist mask]] | ||
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