Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-4: Difference between revisions

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*[[/Slow etch|Slow etch of silicon nitride and silicon oxide]]
*[[/Slow etch|Slow etch of silicon nitride and silicon oxide]]


'''Hardware changes'''


A few hardware modifications have been made on the Pegasus 3/4 since it was installed in 2019. The changes are listed below.
*[[Specific Process Knowledge/Etch/DRIE-Pegasus 4/showerheadchange|Change of showerhead in 2019]]




Revision as of 08:35, 22 August 2023

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Unless otherwise stated, this page is written by DTU Nanolab internal

Pegasus 4 - 150mm silicon oxide and silicon nitride etching

The DRIE-Pegasus3 and DRIE-Pegasus4 operator station and cassette loading stations, Photo: DTU Nanolab internal

The user manual and contact information can be found in LabManager:

DRIE Pegasus 4 in LabManager - requires login

Process information

Standard recipes



Wafer bonding

To find information on how to bond wafers or chips to a carrier wafer, click here.

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