Specific Process Knowledge/Lithography/EBeamLithography/BEAMER: Difference between revisions

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 {| style="border: none; border-spacing: 0; margin: 1em auto; text-align: center;"
 |-
-| [[image:BEAMER_Interleave1.png|300px]] [[image:BEAMER_Interleave2.png|300px]]
+| [[image:BEAMER_Split.png|300px]]
 |-
 | colspan="2" style="text-align:center;|
-Illustration of the ''Interleave'' overlap methods. On the left side ''Interleaving'' is used to interleave the structures at the main field boundary between the fields. On the right side "Interleaving + extra field'' is used to interleave but also add an additional writing field for the interleaved part.
+Illustration of ''Split between fields'' overlap. Over a defined distance at the writing field boundary the geometry is present in both fields but only written with half the dose, as can bee seen by the color of the overlap.
 |}
@@ Line 206: / Line 206: @@
 {| style="border: none; border-spacing: 0; margin: 1em auto; text-align: center;"
 |-
-| [[image:BEAMER_Split.png|300px]]
+| [[image:BEAMER_Interleave1.png|300px]] [[image:BEAMER_Interleave2.png|300px]]
 |-
 | colspan="2" style="text-align:center;|
-Illustration of ''Split between fields'' overlap. Over a defined distance at the writing field boundary the geometry is present in both fields but only written with half the dose, as can bee seen by the color of the overlap.
+Illustration of the ''Interleave'' overlap methods. On the left side ''Interleaving'' is used to interleave the structures at the main field boundary between the fields. On the right side "Interleaving + extra field'' is used to interleave but also add an additional writing field for the interleaved part.
 |}