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Specific Process Knowledge/Etch/DRIE-Pegasus/TrenchCharacterisation: Difference between revisions

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Jmli (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,569 edits
Jmli (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,569 edits
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## Chamber conditioning, steps before the actual etch
## Chamber conditioning, steps before the actual etch
## Wafer ID, Labmanager process log
## Wafer ID, Labmanager process log
## Recipe, duration
## Recipe, duration, number of cycles
## Comments
## Comments
#  
## Mask thickness before and after etch
# '''Input images''': A list of SEM images (only tiff format images from Carl Zeiss SEM's that have a correct header can be used) is entered and measurement points are added to every image one by one.
## The pixel size in the the SEM image is read from the tiff image header


=== Input parameters ===
'''At the SEM'''
However,  The only requirement is that the pixel size of every SEM image is known - one can add it to the datazone: See any SEM manual for instructions - for instance [http://labmanager.dtu.dk/d4Show.php?id=2180&mach=275#dafs29430 '''HERE''']


'''Making measurements'''
'''Making measurements'''
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