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Specific Process Knowledge/Lithography/EBeamLithography/EBLsubstratePrep: Difference between revisions

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=== Resist coating ===
= Resist coating =
An appropriate EBL resist must naturally be applied to the substrate. DTU Nanolab supplies a number of standard resists, please consult the table below. The default positive EBL resist is AR-P 6200.09 (CSAR). CSAR is installed on [[Specific_Process_Knowledge/Lithography/Coaters#Spin Coater: Gamma E-beam and UV|Spin Coater: Gamma E-beam and UV]] for spin coating of 2", 4" and 6" substrates. For other substrate sizes (i.e. chips) or other resists [[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spin_Coaters|Spin Coater: LabSpin 02/03]] have to be used instead. The standard resist bottles are stored in the chemical cupboard in E-4.
An appropriate EBL resist must naturally be applied to the substrate. DTU Nanolab supplies a number of standard resists, please consult the table below. The default positive EBL resist is AR-P 6200.09 (CSAR). CSAR is installed on [[Specific_Process_Knowledge/Lithography/Coaters#Spin Coater: Gamma E-beam and UV|Spin Coater: Gamma E-beam and UV]] for spin coating of 2", 4" and 6" substrates. For other substrate sizes (i.e. chips) or other resists [[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spin_Coaters|Spin Coater: LabSpin 02/03]] have to be used instead. The standard resist bottles are stored in the chemical cupboard in E-4.


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