Specific Process Knowledge/Lithography/EBeamLithography/EBLsubstratePrep: Difference between revisions
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=== Inspection === | === Inspection === | ||
Post exposure pattern dimensions are dependent on resist thickness. Thus, it is advisable to verify resist thickness after spin coating. This can be done by ellipsometry in the [[Specific_Process_Knowledge/Characterization/Optical_characterization#Ellipsometer|VASE Ellipsometer]]. | Post exposure pattern dimensions are dependent on resist thickness. Thus, it is advisable to verify resist thickness after spin coating. This can be done by ellipsometry in the [[Specific_Process_Knowledge/Characterization/Optical_characterization#Ellipsometer|VASE Ellipsometer]]. | ||
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| [[image:RejectedSamples.png| | | [[image:RejectedSamples.png|600px]] | ||
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Example of rejected samples with visible bubbles in resist/Al coating and (a lot) of resist residue on the backside | Example of rejected samples with visible bubbles in resist/Al coating and (a lot) of resist residue on the backside. Photo: Thomas Pedersen. | ||
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