Specific Process Knowledge/Characterization/SEM: Scanning Electron Microscopy: Difference between revisions

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 |style="background:WhiteSmoke; color:black" align="center"|[[Specific_Process_Knowledge/Characterization/SEM_Supra_2|SEM Supra 2]]
 |style="background:WhiteSmoke; color:black" align="center"|[[Specific_Process_Knowledge/Characterization/SEM_Supra_3|SEM Supra 3]]
+|style="background:WhiteSmoke; color:black" align="center"|[[Specific_Process_Knowledge/Characterization/SEM_Gemini_1|SEM Gemini 1]]
+<i>Under installation</i>
 |style="background:WhiteSmoke; color:black" align="center"|[[Specific_Process_Knowledge/Characterization/SEM_Tabletop_1|SEM Tabletop 1]]
 <!--|style="background:WhiteSmoke; color:black" align="center"|[[Specific Process Knowledge/Characterization/SEM FEI QUANTA 200 3D|FEI Quanta 200 3D]]
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 |style="background:WhiteSmoke; color:black" align="center"| Zeiss Supra 60 VP
 |style="background:WhiteSmoke; color:black" align="center"| Zeiss Supra 40 VP
+|style="background:WhiteSmoke; color:black" align="center"| Zeiss GeminiSEM 560
 |style="background:WhiteSmoke; color:black" align="center"| SEM Tabletop 1
 <!--|style="background:WhiteSmoke; color:black" align="center"| FEI Quanta 200 3D-->
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 * Thin (~ 5 µm <) layers of non-conducting materials such as polymers
 * Thick polymers, glass or quartz samples
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+*
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 * Conducting samples
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 * Surface material analysis using EDX
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 *Cleanroom of DTU Nanolab in building 346
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+*Cleanroom of DTU Nanolab
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 *Building 451 - room 913
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 !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
 |style="background:LightGrey; color:black" rowspan="2" align="center" |Resolution
-|style="background:Whitesmoke; color:black" colspan="4" align="center"| The resolution of a SEM is strongly dependent on the type of sample and the skills of the operator. The highest resolution is probably only achieved on special samples
+|style="background:Whitesmoke; color:black" colspan="5" align="center"| The resolution of a SEM is strongly dependent on the type of sample and the skills of the operator. The highest resolution is probably only achieved on special samples
 |-
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+* 1-2 nm (limited by vibrations)
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 * 1-2 nm (limited by vibrations)
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 * Inlens secondary electron (Inlens)
 * High Definition four quadrant Angular Selective Backscattered electron detector (HDAsB)
+* Variable pressure secondary electron (VPSE)
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+* Secondary electron (Se2)
+* Inlens secondary electron (Inlens)
+*
 * Variable pressure secondary electron (VPSE)
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 * X, Y: 150 &times; 150 mm
 * T: -10 to 70<sup>o</sup>
+* R: 360<sup>o</sup>
+* Z: 50 mm
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+* X, Y: 130 &times; 130 mm
+* T: -4 to 70<sup>o</sup>
 * R: 360<sup>o</sup>
 * Z: 50 mm
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 |-
 |style="background:LightGrey; color:black" align="center" |Electron source
-|style="background:Whitesmoke; color:black" colspan="3" align="center"| FEG (Field Emission Gun) source
+|style="background:Whitesmoke; color:black" colspan="4" align="center"| FEG (Field Emission Gun) source
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 * Thermionic tungsten filament
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 |-
 |style="background:LightGrey; color:black" align="center" |Operating pressures
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+* Fixed at High vacuum (2 &times; 10<sup>-4</sup>mbar - 10<sup>-6</sup>mbar)
+* Variable at Low vacuum (0.1 mbar-2 mbar)
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 * Fixed at High vacuum (2 &times; 10<sup>-4</sup>mbar - 10<sup>-6</sup>mbar)
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 *High Definition four quadrant Angular Selective Backscattered electron detector (HDAsB)
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+* Antivibration platform
+*
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 * Up to 8" wafer with 6" view
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+*  Up to 6" wafer with full view
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 *  Up to 6" wafer with full view
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 * Any standard cleanroom material and samples from the 	Laser Micromachining tool and the Polymer Injection Molding tool
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+* Any standard cleanroom materials
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 * Any standard cleanroom materials