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Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-4/SiO2 Etch: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
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Bghe (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
7,301 edits
Line 78: Line 78:
|-
|-
|H2 flow [sccm]
|H2 flow [sccm]
|15
|25.6


|-
|-
|C<sub>4</sub>F<sub>8</sub> flow [sccm]
|C<sub>4</sub>F<sub>8</sub> flow [sccm]
|30
|25.6


|-
|-
|He flow [sccm]
|He flow [sccm]
|
|448.7


|-
|-
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