Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-4/SiO2 Etch: Difference between revisions
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==Testing with electromagnetic coils== | ==Testing with electromagnetic coils== | ||
{| border="2" cellspacing="2" cellpadding="3" | |||
!Parameter | |||
|Recipe name: '''no 10 with lower platen power''' | |||
|- | |||
|Coil Power [W] | |||
|2500 | |||
|- | |||
|Platen Power [W] | |||
|200 | |||
|- | |||
|Platen temperature [<sup>o</sup>C] | |||
|20 | |||
|- | |||
|H2 flow [sccm] | |||
|15 | |||
|- | |||
|C<sub>4</sub>F<sub>8</sub> flow [sccm] | |||
|30 | |||
|- | |||
|He flow [sccm] | |||
| | |||
|- | |||
|Pressure | |||
|Fully open APC valve (8-9 mTorr) | |||
|- | |||
|} | |||