Specific Process Knowledge/Back-end processing/Wire Bonder: Difference between revisions

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==TPT Wire Bonder==
==TPT Wire Bonder==
<!-- copyright issue kabi
[[Image:bond head - wedge insert.jpg|300px|thumb|Bond head with insert <br/> showing wedge capillary]]
[[Image:TPT-wirebonder.jpg|300x300px|thumb|TPT Wire Bonder,<br/> Packlab, Building 347, 1st floor]]
-->


[[Image:section under construction.jpg|70px]] ''Will be temporary taken out of service during the PolyFabLab construction.''
[[Image:section under construction.jpg|70px]] ''Will be temporary taken out of service during the PolyFabLab construction.''

Revision as of 10:49, 23 June 2023

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TPT Wire Bonder

Bond head with insert
showing wedge capillary

Will be temporary taken out of service during the PolyFabLab construction.

The TPT Wire Bonder is bought i 2007. Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT-H05 is a manuel wire bonder. It is possible to do wedge bonding with either aluminum wires or gold wires as well as gold ball bonding.

The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):

TPT Wire Bonder

Ball Wire Bonder K&S 4524

Will be moved to building 451 during the PolyFabLab construction.

The Ball Wire Bonder K&S 4524 is for high precision ball bonding. It is a semi-automatic wire bonder with good control of bond placement and bonding parameters.

The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):

Ball Wire Bonder

Equipment performance and process related parameters

Ball wire bond
Equipment TPT Wire Bonder Ball Wire Bonder
Purpose
  • Al and Au 25µm wire bonding
  • Wedge and ball wire bonding
  • Au ribbon (100x20µm) bonding
    (we have tools and wire but it has not been tested)
  • Au 25µm wire bonding
  • Ball wire bonding
Performance
  • Manual operation
  • Wedge bonding:
    • recommended min. bonding area 200 µm x 200 µm
  • Ball bonding:
    • recommended min. bonding area 200 µm x 200 µm
    • recommended temperature 120 oC.
  • Semi-automatic and manual operation
  • Bond placement laser pointer
  • recommended min. bonding area 100 µm x 100 µm
  • recommended temperature 120 oC.
Substrates Allowed materials
  • Should be able to withstand the wire bonding temperature
  • Typical materials are: Alumina (Al2O3), AluminumNitride (AlN), std. circuit boards (FR4)


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