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Specific Process Knowledge/Thin film deposition/Deposition of Palladium: Difference between revisions

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<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i>
<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i>


 
===Palladium deposition===
Palladium can be deposited by e-beam evaporation or DC sputtering.  
Palladium can be deposited by e-beam evaporation or DC sputtering at DTU Nanolab.


==Sputtering of Palladium==
==Sputtering of Palladium==
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*[[/Pd sputtering in Sputter System (Lesker) |Pd sputtering in Sputter System (Lesker)]]
*[[/Pd sputtering in Sputter System (Lesker) |Pd sputtering in Sputter System (Lesker)]]


 
==Equipment comparison==
In the chart below you can compare the different deposition equipment:  
In the chart below you can compare the different deposition equipment:  


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! E-beam evaporation ([[Specific_Process_Knowledge/Thin_film_deposition/Wordentec|Wordentec]])
! E-beam evaporation ([[Specific_Process_Knowledge/Thin_film_deposition/Wordentec|Wordentec]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Sputter-System (Lesker)]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Sputter-System (Lesker)]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3)]])


|-  
|-  
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| E-beam deposition of Pd
| E-beam deposition of Pd
| Sputter deposition of Pd
| Sputter deposition of Pd
 
| Sputter deposition of Pd
|-
|-
|-style="background:Lightgrey; color:black"
|-style="background:Lightgrey; color:black"
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|none
|none
|RF Ar clean
|RF Ar clean
 
|RF Ar clean
|-
|-
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
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|10 Å - 600 nm*
|10 Å - 600 nm*
|10 Å - 600 nm*
|10 Å - 600 nm*
 
|10 Å - ? ''discuss with staff''
|-
|-
|-style="background:Lightgrey; color:black"
|-style="background:Lightgrey; color:black"
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|2 Å/s to 10Å/s
|2 Å/s to 10Å/s
|Up to 4.3 Å/s
|Up to 4.3 Å/s
 
| Not yet known - discuss with staff
|-
|-
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
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*1x6" wafer or
*1x6" wafer or
*several small samples
*several small samples
 
|
*Up to 10x4" or 6" wafers
*Many smaller pieces
|-
|-
|-style="background:Lightgrey; color:black"
|-style="background:Lightgrey; color:black"
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*Metals
*Metals
*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]
*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet]
| Almost any that do not degas


|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
! Comment
! Comment
|
|
|
|
|
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