Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions

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*[[Specific Process Knowledge/Etch/DRIE-Pegasus/FAQ/Hardware|Hardware and setup]]
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/FAQ/Hardware|Hardware and setup]]
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/FAQ/Bonding|Bonding wafers]]
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/FAQ/Matching|Problems with matching]]

Revision as of 13:28, 24 February 2011

This page is under construction

The DRIE-Pegasus takes the well established Bosch process known from the ASE a significant step further.


Some questions and answers

This section contains material from email correspondence with SPTS.

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