Specific Process Knowledge/Etch/ICP Metal Etcher: Difference between revisions
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<gallery caption="Standardization images of the shallolr recipe" widths="300px" heights="300px" perrow="2"> | <gallery caption="Standardization images of the shallolr recipe" widths="300px" heights="300px" perrow="2"> | ||
Image:WF 2F-6_dec092010-30_nm | Image:WF 2F-6_dec092010-30_nm.jpg|The 30 nm trenches are somewhat wider due to overexposure of E-beam resist | ||
image:WF 2F-6_dec092010-120_nm | image:WF 2F-6_dec092010-120_nm.jpg|The 30 nm trenches are somewhat wider due to overexposure of E-beam resist | ||
</gallery> | </gallery> | ||
It looks like the trenches are closing up as the etch goes deeper, consistent with too much polymer deposition on the sidewall. | It looks like the trenches are closing up as the etch goes deeper, consistent with too much polymer deposition on the sidewall. | ||