Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2: Difference between revisions
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|ItemName= Electrostatic clamping | |ItemName= Electrostatic clamping and helium backside cooling are again mandatory. | ||
|ItemConfiguration= The processes run in Pegasus 2 operate at such low powers that they do not require very efficient cooling. It has therefore been decided that the following options/procedures | |ItemConfiguration= The processes run in Pegasus 2 operate at such low powers that they do not require very efficient cooling. It has therefore been decided that the following options/procedures | ||
* Electrostatic clamping of carriers/substrates | * Electrostatic clamping of carriers/substrates | ||
* Helium backside cooling | * The Helium backside cooling is kept at 5 Torr instead of the usual 10 Torr on the other Pegasus tools. | ||
* Using bonding procedures such as droplets of Galden oil to increase thermal contact between chips and carrier | * Using bonding procedures such as droplets of Galden oil to increase thermal contact between chips and carrier | ||
will no longer be required. | will no longer be required. | ||