Specific Process Knowledge/Etch/DRIE-Pegasus/System-description: Difference between revisions
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This section applies to all Pegasus tools. For Pegasus 4, however, it is less important as dielectrics etches are continuous. | |||
This section applies to all Pegasus tools. For Pegasus 4, however, it is less important as dielectrics etches are continuous. | |||
The DRIE-Pegasus tools take the well established Bosch process known from the [[Specific_Process_Knowledge/Etch/ASE_(Advanced_Silicon_Etch)|ASE]] a significant step further. In the ASE the Bosch process has two cycles, etch and passivation. During each cycle the process parameters are kept constant: | The DRIE-Pegasus tools take the well established Bosch process known from the [[Specific_Process_Knowledge/Etch/ASE_(Advanced_Silicon_Etch)|ASE]] a significant step further. In the ASE the Bosch process has two cycles, etch and passivation. During each cycle the process parameters are kept constant: | ||