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Specific Process Knowledge/Lithography/EBeamLithography/JEOLJobPreparation: Difference between revisions

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'''GLMDET [mode]'''
'''GLMDET [mode]'''


GLMDET (GLobal Mark DETect) has four modes
'''GLMDET''' (GLobal Mark DETect) has four modes


*A - for automatic alignment
*A - for automatic alignment
*S - for semiautomatic alignment
*S - for semi automatic alignment
*M - for manual alignment
*M - for manual alignment
*C - for cancel, i.e. no alignment
*C - for cancel, i.e. no alignment


In automatic mode the system will execute the SETWFR subprogram to find the global alignment marks (P and Q) by beam scans. SETWFR will execute mark detection at the P and Q mark locations defined in the JDF file. at their designated locations by beam scans as set up in the SETWFR subprogram.
In automatic mode the system will execute the '''SETWFR''' subprogram to find the global alignment marks (P and Q) by beam scans. '''SETWFR''' will execute mark detection at the P and Q mark locations defined in the JDF file. If alignment fails the system will continue to the next sequence in the SDF file. In semi automatic mode the system will carry out the same alignment procedure as automatic mode but if the mark scan fails the system will ask the user to use SEM mode to manually find the mark. When the mark is found in SEM mode the user can choose to designate the position as the true mark position or request another beam scan at the found location. Thus, semi automatic is somewhat more versatile at it allows the user to manually find the mark upon failure. Manual alignment allows the user to use SEM mode and manually find and identify the location of the center of the mark. Cancel mode skips global alignment. In the example above automatic alignment is used.
 
 
'''CHIPAL [mode]'''
 
'''CHIPAL''' has six modes and is explained in the section below on chip alignment. Even though chip alignment is not used during global alignment it is necessary to include the command and set it to either 0, V1 or V4, as explained below. In the example above '''CHIPAL''' is disregarded by setting it to 0.
 
 
'''HSWITCH [swg,swc]'''
 
'''HSWITHC''' specifies the substrate height detection mode for aligned exposure. It takes two parameters '''swg''' and '''swc''' which are merely two ON/OFF switches for global mark and chip marks, respectively. If '''swg''' is set to ON the system will carry out substrate height measurement at the global mark positions. If '''swc''' is set to ON the system will carry out substrate height measurement at the chip mark positions. Thus this is a convenient way to have the system measure substrate height and adjust beam focus to chip placement positions. In the example above the global mark positions are used for height detection of the substrate.


===Global alignment JDF===
===Global alignment JDF===