Specific Process Knowledge/Lithography/EBeamLithography/JEOLJobPreparation: Difference between revisions
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The JDF is terminated with a END command. | The JDF is terminated with a END command. | ||
=Alignment exposure | =Alignment exposure= | ||
As described in the pattern preparation section there is two different strategies for pattern alignment. One can expose a wafer scale layout based on two global alignment marks or one can do chip exposures where each chip is individually aligned to an individual chip mark, as illustrated below. In both cases the SDF and JDF files have to be expanded with additional features to call and define the alignment procedure. Below is two examples, one for global alignment and one for chip alignment. Only new commands relative to the above example will be commented. | As described in the pattern preparation section there is two different strategies for pattern alignment. One can expose a wafer scale layout based on two global alignment marks or one can do chip exposures where each chip is individually aligned to an individual chip mark, as illustrated below. In both cases the SDF and JDF files have to be expanded with additional features to call and define the alignment procedure. Below is two examples, one for global alignment and one for chip alignment. Only new commands relative to the above example will be commented. | ||