Specific Process Knowledge/Lithography/EBeamLithography/JEOLJobPreparation: Difference between revisions

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 OBJAPT 5
+END
+</pre>
+===Chip alignment - SDF ===
+<pre>
+MAGAZIN	'THOPE'
+;---------------------------
+#8
+%4C
+JDF	'thope230111A',1
+ACC 100
+CALPRM '6na_ap5'
+DEFMODE 2      ;2_stage deflection
+GLMDET S
+CHIPAL 1
+HSWITCH OFF,ON
+RESIST 250
+SHOT A,6
+OFFSET(-44,-139)
+;---------------------------
+END 8
+</pre>
+==Chip alignment - JDF ===
+<pre>
+JOB/W    'THOPE',4  ; 4inch wafer
+GLMPOS    P=(-30000,0),Q=(30000,0)
+PATH FT01
+  ARRAY	(-15000,2,30000)/(10000,2,20000)
+	ASSIGN A(1) -> ((1,1))
+: 	ARRAY (-4000,5,2000)/(4000,5,2000)
+	CHMPOS M1=(-450,450),M2=(450,450),M3=(450,-450),M4=(-450,-450)
+	ASSIGN P(1) -> (*,*)
+  AEND
+PEND
+LAYER	1
+        P(1)  'thope230111.v30'
+        SPPRM 4.0,,,,1.0,1
+        STDCUR  6
 END
 </pre>