Specific Process Knowledge/Lithography/EBeamLithography/JEOLJobPreparation: Difference between revisions

@@ Line 232: / Line 232: @@
 <pre>
-MAGAZIN    'ELELOP'
+MAGAZIN    'THOPE'
-;------------------------------------------------------------
 #8
 % 4A
-JDF     '21031L2',1 		;JDF file containing the array of doses with PEC
+JDF     '21031L2',1
 ACC 100
-CALPRM '6na_ap5'      	    ;Giving a beam spot of ca. 38nm, if larger needed can use 60na giving 55nm beam spot
+CALPRM '6na_ap5'
 DEFMODE 2
-GLMDET A						; This line defines which type of alignment is done A =  automatic, M = manual or S = semiatuomatic
+GLMDET A
-CHIPAL 0						; Tells how many marks are used for the chip alignment. 1 if only top-left mark, 4 if 4 marks starting from the top-left and clockwise doing the rest
+CHIPAL 0
 HSWITCH OFF,OFF
-RESIST 152                  ;According to process flow this is the base dose to be used (200um/cm2) . Modulation included in jdf file
+RESIST 152
-SHOT A,32                   ;In units of 0.25nm, this means a step of 13nm (this small needed? check dwell time)
+SHOT A,32
 OFFSET(0,0)
-; Repeat above in case of more than one slot to expose
+END 8
+</pre>
-END 8						; Or next user's cassette :) Be nice!
+Compared to the first print exposure the SDF file has three extra commands, '''GLMDET''', '''CHIPAL''' and '''HSWITCH'''.
-</pre>
 ==Global alignment - jobdeck file==