Specific Process Knowledge/Characterization: Difference between revisions
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*[[/Optical characterization#Filmtek_4000|Filmtek 4000]] | *[[/Optical characterization#Filmtek_4000|Filmtek 4000]] | ||
*[[/Optical characterization#Prism_Coupler|Prism Coupler]] | *[[/Optical characterization#Prism_Coupler|Prism Coupler]] | ||
===[[Specific_Process_Knowledge/III-V_Process/characterisation/PL_Mapper|Photoluminescence Mapper]]=== | |||
===[[/SIMS: Secondary Ion Mass Spectrometry|SIMS: Secondary Ion Mass Spectrometry]]=== | ===[[/SIMS: Secondary Ion Mass Spectrometry|SIMS: Secondary Ion Mass Spectrometry]]=== | ||
Revision as of 10:23, 9 December 2010
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- Sample imaging
- Topographic measurement
- Stress measurement
- Measurement of film thickness and optical constants
- Wafer thickness measurement
- Element analysis
- Hydrophobicity measurement
- Resistivity measurement
- Other electrical measurements