Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 02 processing: Difference between revisions
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[[Image:MLA150_label.JPG|400x400px|thumb|An example of wafer ID produced by the labeling function]] | [[Image:MLA150_label.JPG|400x400px|thumb|An example of wafer ID produced by the labeling function]] | ||
The conversion manager software allows for inclusion of labels during the design conversion process. The labels are configured in a .lbl tab-delimited ASCII file with a special header in the first row, which must be located in the 'HIMT\ | The conversion manager software allows for inclusion of labels during the design conversion process. The labels are configured in a .lbl tab-delimited ASCII file with a special header in the first row, which must be located in the 'HIMT\Designs_conversion_PC\Labels' folder. When used, the labels defined in the label file will be merged with the pattern in the source file, and the result can be inspected in the viewer. The X and Y positions of the labels should be given in design coordinates, and will be subject to any offsets/shifts applied to the design. Note, that if the label file is changed, the job file will not update automatically. | ||
'''Example of a label file:''' | '''Example of a label file:''' | ||
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-16000 | -46000 | um | 2000 | um | TARAN DTU Nanolab 20190320 | -16000 | -46000 | um | 2000 | um | TARAN DTU Nanolab 20190320 | ||
This produces a | This produces a 2 mm high, approximately 32 mm long, wafer ID at the flat of a 100 mm wafer. Some special characters are not allowed (eg. ';'). | ||
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