Specific Process Knowledge/Lithography/EBeamLithography/JEOL 9500 User Guide: Difference between revisions

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 Retrieving a cassette from the automatic cassette transfer system
-*Toggle the system to "Local" operation mode
+*Toggle the system to '''Local''' operation mode
 *Identify the shelf number for the cassette in question
-*Use the "shelf selector" to choose that number
+*Use the '''shelf selector''' to choose that number
 *Press the transfer button to transfer it from the shelf to the port/door
-*Once the robot is done, click "Open" to unlock the door
+*Once the robot is done, click '''Open''' to unlock the door
 *Open door, retrieve cassette and place it on a layer of tissues on the cassette preparation table
 *Close the door
-*Click "Close" to lock the door
+*Click '''Close''' to lock the door
-*Set the system back to "Remote" operation
+*Set the system back to '''Remote''' operation
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 General rules for handling cassettes and mounting wafers and chips into cassettes:
-*'''Always wear''' face-mask and a new pair of gloves
+*Always wear face-mask and a new pair of gloves
-*'''Never put cassettes directly on the table; use lint-free cleanroom tissues'''
+*Never put cassettes directly on the table, use lint-free cleanroom tissues
-*'''Never touch''' the reference planes, i.e. the six polished areas on the front side of the cassette
+*Never touch the reference planes, i.e. the six polished areas on the front side of the cassette
-*'''Never lift''' the cassette in the hook
+*Never lift the cassette in the hook
-*'''Always check''' the wafer for loose parts or flakes before loading. In case of loose parts or flakes, stop mounting, discard or rework the sample and rethink your process.
+*Always check the wafer for loose parts or flakes before loading. In case of loose parts or flakes, stop mounting, discard or rework the sample and rethink your process.
-*'''Always check''' the cassette for loose parts, dust and particles.
+*Always check the cassette for loose parts, dust and particles.
-*'''For chips:''' Make sure the chip size is at least 2 mm larger than the slot opening. Be careful when mounting the plate; it will get stuck easily if mounted askew.
+*When exposing chips, make sure the chip size is at least 2 mm larger than the slot opening. Be careful when mounting the cover plate, it will get stuck easily if mounted at a slight tilt. '''Never push the cover into place,''' it must fall in by itself.
-*'''For wafers:''' When mounting a wafer, hold the spring (wafer securing pin) back when putting the wafer and the plate into the cassette, especially on the 2" cassette (the spring can lift the wafer). Tighten the leaf spring first, then release the spring and tighten the rotation lock lever.
+*When mounting a wafer, hold the spring (wafer securing pin) back when putting the wafer and the cover into the cassette, especially on the 2" cassette (the spring can lift the wafer). Tighten the leaf spring first, then release the spring and tighten the rotation lock lever.
-*'''Inspect''' the front side of the cassette carefully after mounting the chip/wafer; a small gap between substrate and cassette will lead to a failure in HEIMAP and no exposure is thus possible.
+*Inspect the front side of the cassette carefully after mounting the chip/wafer; a small gap between substrate and cassette will lead to a failure in HEIMAP and no exposure is thus possible.
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