Specific Process Knowledge/Lithography/EBeamLithography/JEOL 9500 User Guide: Difference between revisions
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*'''Always check''' the wafer for loose parts or flakes before loading. In case of loose parts or flakes, stop mounting, discard or rework the sample and rethink your process. | *'''Always check''' the wafer for loose parts or flakes before loading. In case of loose parts or flakes, stop mounting, discard or rework the sample and rethink your process. | ||
*'''Always check''' the cassette for loose parts, dust and particles. | *'''Always check''' the cassette for loose parts, dust and particles. | ||
*'''For chips:''' Make sure the chip size is at least 2 mm larger than the slot opening. Be careful when mounting the plate; it will get stuck easily if mounted askew | *'''For chips:''' Make sure the chip size is at least 2 mm larger than the slot opening. Be careful when mounting the plate; it will get stuck easily if mounted askew. | ||
*'''For wafers:''' When mounting a wafer, hold the spring (wafer securing pin) back when putting the wafer and the plate into the cassette, especially on the 2" cassette (the spring can lift the wafer). Tighten the leaf spring first, then release the spring and tighten the rotation lock lever. | *'''For wafers:''' When mounting a wafer, hold the spring (wafer securing pin) back when putting the wafer and the plate into the cassette, especially on the 2" cassette (the spring can lift the wafer). Tighten the leaf spring first, then release the spring and tighten the rotation lock lever. | ||
*'''Inspect''' the front side of the cassette carefully after mounting the chip/wafer; a small gap between substrate and cassette will lead to a failure in HEIMAP and no exposure is thus possible. | *'''Inspect''' the front side of the cassette carefully after mounting the chip/wafer; a small gap between substrate and cassette will lead to a failure in HEIMAP and no exposure is thus possible. | ||
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