Jump to content

Specific Process Knowledge/Lithography/EBeamLithography/JEOL 9500 User Guide: Difference between revisions

Thope (talk | contribs)
Thope (talk | contribs)
Line 41: Line 41:
{| style="border: none; border-spacing: 0; margin: 1em auto; text-align: center;"
{| style="border: none; border-spacing: 0; margin: 1em auto; text-align: center;"
|-
|-
| [[image:BSPCL-520.png|800px]]
| [[image:BSPCL-520.png|1200px]]
|-  
|-  
| colspan="1" style="text-align:center;|
| colspan="1" style="text-align:center;|
Back side (left )and front side view (right) of the 4" wafer titanium cassette (BSPCL-520).
Back side (left )and front side view (right) of the 4" wafer titanium cassette (BSPCL-520).
|}
|}
Substrates


For the tutorial job we are using a 4" wafer and hence it must be mounted in one of the 4” cassettes, in this case the 4" aluminium cassette (BM2P-011). If a cassette has been used recently it might be found on the cassette preparation table already, otherwise it will have to be retrieved from the cassette transfer system. This is done from the operation screen of the cassette transfer system.  
For the tutorial job we are using a 4" wafer and hence it must be mounted in one of the 4” cassettes, in this case the 4" aluminium cassette (BM2P-011). If a cassette has been used recently it might be found on the cassette preparation table already, otherwise it will have to be retrieved from the cassette transfer system. This is done from the operation screen of the cassette transfer system.