Specific Process Knowledge/Back-end processing: Difference between revisions
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* Chip/die mounting | * Chip/die mounting | ||
**[[/Die Bonder|Die Bonder (eutectic metal)]] | **[[/Die Bonder|Die Bonder (eutectic metal)]] [[Image:section under construction.jpg|70px]] '''Will be temporary taken out of service during the PolyFabLab construction.''' | ||
*Wire bonding | *Wire bonding | ||
**[[/Wire Bonder|TPT Wire Bonder]] | **[[/Wire Bonder|TPT Wire Bonder]] [[Image:section under construction.jpg|70px]] '''Will be temporary taken out of service during the PolyFabLab construction.''' | ||
**[[/Wire Bonder#Ball Wire Bonder K&S 4524|Ball Wire Bonder]] | **[[/Wire Bonder#Ball Wire Bonder K&S 4524|Ball Wire Bonder]] | ||
*Wafer dicing/machining | *Wafer dicing/machining | ||
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*[[/Die Bonder|Die Bonder (eutectic metal)]] | *[[/Die Bonder|Die Bonder (eutectic metal)]] | ||
*[[/Die Bonder#Flip-chip bonder (glue attachment)|Flip-chip Bonder (glue)]] | <!-- *[[/Die Bonder#Flip-chip bonder (glue attachment)|Flip-chip Bonder (glue)]] --> | ||
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*[[/Wire Bonder|TPT Wire Bonder]] | *[[/Wire Bonder|TPT Wire Bonder]] | ||
Revision as of 15:01, 6 March 2023
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Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.
Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it.
These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346.
| Note! Packlab will be closed from February/March 2023 to Q2 2024 due to the construction of our new PolyFabLab. |
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| Some of the tools will find new temporary locations in building 346 or building 451. Please ask our staff for more information. |
Below you can see a list of equipment for back-end processing that is available at DTU Nanolab.
Choose an equipment
- Stylus profilometer measurements
- Chip/die mounting
- Die Bonder (eutectic metal)
Will be temporary taken out of service during the PolyFabLab construction.
- Die Bonder (eutectic metal)
- Wire bonding
- TPT Wire Bonder Will be temporary taken out of service during the PolyFabLab construction.
- Ball Wire Bonder
- TPT Wire Bonder
- Wafer dicing/machining
- Molding
Choose processing method
| Lapping/polishing | Cutting | Milling | Die bonding | Wire bonding |