Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions
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<!-- remember to remove the type of documents that are not present --> | <!-- remember to remove the type of documents that are not present --> | ||
<!-- give the link to the equipment info page in LabManager: --> | <!-- give the link to the equipment info page in LabManager: --> | ||
**[http://labmanager. | **[http://labmanager.nanolab.dtu.dk/function.php?module=Machine&view=view&mach=168 DAD 321 Saw in LabManager] | ||
**[http://labmanager. | **[http://labmanager.nanolab.dtu.dk/function.php?module=Machine&view=view&mach=489 DAD 3241 Saw in LabManager] | ||
*[[Specific Process Knowledge/Back-end processing/Disco Saw#Comparing dicing parameters for different materials |Comparing dicing parameters for different materials]] | *[[Specific Process Knowledge/Back-end processing/Disco Saw#Comparing dicing parameters for different materials |Comparing dicing parameters for different materials]] | ||
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===Overview of the performance Disco DAD 321 and DAD 3241 Dicer=== | ===Overview of the performance Disco DAD 321 and DAD 3241 Dicer=== | ||
[[Image: | [[Image:IMG 20230228 113020.jpg|thumb|Wafer mounter for DAD 3241]] | ||
[[Image: | [[Image:IMG 20230228 113035.jpg|thumb|UV curing/Tape release]] | ||
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===Comparing dicing parameters for different materials '''DAD 321'''=== | ===Comparing dicing parameters for different materials '''DAD 321'''=== | ||
[[Image: | [[Image:IMG 20230228 113045.jpg|250x500px|thumb|Wafer cleaning station DCS 1441]] | ||
Do not mix blades for the DAD 321 with the blades for the DAD 3241. They have different outer diameters | Do not mix blades for the DAD 321 with the blades for the DAD 3241. They have different outer diameters | ||