Specific Process Knowledge/Lithography/EBeamLithography/Cassettes: Difference between revisions
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When placing a substrate in a cassette it is essential to know the relation between the cassette coordinate system and the design coordinate system. On wafer cassettes this is very obvious as they have a flat pin where the flat of the wafer will sit. On chip cassettes the substrate can however be placed at any rotation and hence the exposed pattern can end up upside down if one does not pay attention to this. | When placing a substrate in a cassette it is essential to know the relation between the cassette coordinate system and the design coordinate system. On wafer cassettes this is very obvious as they have a flat pin where the flat of the wafer will sit. On chip cassettes the substrate can however be placed at any rotation and hence the exposed pattern can end up upside down if one does not pay attention to this. | ||
== | == Cassette overview == | ||
{| class="wikitable" | {| class="wikitable" | ||
|+ | |+ Cassette overview | ||
|- | |- | ||
! | ! Substrate size !! ID !! Slot ID !! Material !! Image | ||
|- | |||
| Chips || BM4P-509 || 3A, 3B, 3C, 3D || Ti || Image | |||
|- | |||
| Chips || BM4P-510 || 3A, 3B, 3C, 3D || Ti || Image | |||
|- | |- | ||
| 2" || BM6P-006 || 2A, 2B, 2C, 2D, 2E, 2F || Al || Image | | 2" || BM6P-006 || 2A, 2B, 2C, 2D, 2E, 2F || Al || Image | ||