Specific Process Knowledge/Lithography/Resist/UserBottles: Difference between revisions
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When spin coating thin resist, you should always use a pipette, to transfer resist from your bottle to the substrate. If you pour the resist directly from your bottle, you will leave resist in the bottle threading, which will dry and create particles in the resist. The disposable pipettes need to be thoroughly cleaned with a N2 gun before use, for ~20 seconds. After some practice, you can obtain particle-free 4" wafers, if the bottle and pipette (and spin coater) are properly cleaned. | When spin coating thin resist, you should always use a pipette, to transfer resist from your bottle to the substrate. If you pour the resist directly from your bottle, you will leave resist in the bottle threading, which will dry and create particles in the resist. The disposable pipettes need to be thoroughly cleaned with a N2 gun before use, for ~20 seconds. After some practice, you can obtain particle-free 4" wafers, if the bottle and pipette (and spin coater) are properly cleaned. | ||
It can be difficult to use the pipettes for thick resists, and | It can be difficult to use the pipettes for thick resists, and you may need to simply pour it from the bottle. Remember to wipe the bottle thread after pouring. It is essential that you wipe in such a way, that you do not create particles, which fall into the resist bottle. | ||