Specific Process Knowledge/Back-end processing/Polishing machine: Difference between revisions
No edit summary |
No edit summary |
||
| Line 8: | Line 8: | ||
== Polisher/Lapper == | == Polisher/Lapper == | ||
<!--[[image:Logitech pm5 1.jpg|400px|right|thumb|The Logitech PM5 Polisher/Lapper]] | |||
Training is required before using th machine. The machine is equipped with a LabManager lock. | Training is required before using th machine. The machine is equipped with a LabManager lock.--> | ||
The Logitech PM5 Polisher/Lapper is for thinning down wafers and other substrates. | The Logitech PM5 Polisher/Lapper is for thinning down wafers and other substrates. | ||