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Specific Process Knowledge/Characterization/XRD/Process Info: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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Eves (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,346 edits
Line 53: Line 53:
==2θ scan. Graizing Incident X-ray Diffraction (GiXRD)==
==2θ scan. Graizing Incident X-ray Diffraction (GiXRD)==


<gallery caption="XPS recordings. 10 nm SiC deposited on Si wafer" widths="700px" heights="550px" perrow="1">
<gallery caption="XPS recordings. 10 nm SiC deposited on Si wafer" widths="700px" heights="480px" perrow="1">
image:eves_XRD_drawing_series_GiXRD_20230206.png|<b>C 1s</b> signal.
image:eves_XRD_drawing_series_GiXRD_20230206.png|<b>C 1s</b> signal.
</gallery>
</gallery>
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