Specific Process Knowledge/Bonding/Wafer Bonder 02: Difference between revisions
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[[Image:wafer bonder2.jpg|300x300px|thumb|Wafer Bonder 02: Positioned in cleanroom E-4]] | [[Image:wafer bonder2.jpg|300x300px|thumb|Wafer Bonder 02: Positioned in cleanroom E-4]] |
Revision as of 07:23, 6 February 2023
Feedback to this page: click here Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.
All links to Labmanager requires login
The Wafer bonder 02 is a system for bonding. 3 different types of bonding can be done: Anodic, Eutectic and Fusion. Furthermore it is possible to align the wafers one wishes to bond. It is also possible to process and align pieces.
The user manual, quality control procedure and results, user APV(s), and contact information can be found in LabManager: Equipment info in LabManager
Process information
Types of Bonding
Purpose | Bonding |
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Performance | Alignment accuracy |
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Process parameter range | Process Temperature |
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Process pressure |
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Piston Force |
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Substrates | Batch size |
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Substrate material allowed |
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Material allowed on the substrate |
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