Specific Process Knowledge/Thermal Process/Furnace Noble: Difference between revisions

@@ Line 16: / Line 16: @@
 |style="background:LightGrey; color:black"|
 |style="background:WhiteSmoke; color:black"|
-* 25 4" wafers can be processed simultaneously
+*
 |-
 !style="background:silver; color:black" align="left" valign="top" rowspan="3"|Process parameter range
@@ Line 34: / Line 34: @@
 |style="background:LightGrey; color:black"|Batch size
 |style="background:WhiteSmoke; color:black"|
-*1-30 4" wafer (or 2" wafers) per run
+*1-25 4" wafer (or 2" wafers) per run
 |-
 | style="background:LightGrey; color:black"|Substrate material allowed