Specific Process Knowledge/Lithography/Strip: Difference between revisions
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{|border="1" cellspacing="1" cellpadding="10" style="text-align:left;" | {|border="1" cellspacing="1" cellpadding="10" style="text-align:left;" | ||
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|-style="background:silver; color:black" | |||
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! Photoresist stripping | ! Photoresist stripping | ||
! [[Specific_Process_Knowledge/Lithography/Descum|Descum after lithography]] | ! [[Specific_Process_Knowledge/Lithography/Descum|Descum after lithography]] | ||
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! Ashing of organic material | ! Ashing of organic material | ||
|- | |- | ||
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|-style="background:whitesmoke; color:black" | |||
!Process pressure | |||
|0.8- 1.2mbar | |0.8- 1.2mbar | ||
|0.5- 1.0mbar | |0.5- 1.0mbar | ||
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|0.8-1.5mbar | |0.8-1.5mbar | ||
|- | |- | ||
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|-style="background:silver; color:black" | |||
!Process gases | |||
| | | | ||
*O<sub>2</sub> (400 sccm) | *O<sub>2</sub> (400 sccm) | ||
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|O<sub>2</sub> | |O<sub>2</sub> | ||
|- | |- | ||
| | |||
|-style="background:whitesmoke; color:black" | |||
!Process power | |||
|600-1000W | |600-1000W | ||
|150-300W | |150-300W | ||
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|1000W or less for heat- sensitive materials | |1000W or less for heat- sensitive materials | ||
|- | |- | ||
| | |||
|-style="background:silver; color:black" | |||
!Process time | |||
|5-60 minutes | |5-60 minutes | ||
|1-5 minutes | |1-5 minutes | ||
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|Between 0.5 and 20 hours, depending on the material | |Between 0.5 and 20 hours, depending on the material | ||
|- | |- | ||
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|-style="background:whitesmoke; color:black" | |||
!Batch size | |||
|1-30 | |1-30 | ||
|1-10 | |1-10 | ||