Specific Process Knowledge/Etch/Etching of Silicon Nitride: Difference between revisions
Appearance
No edit summary |
|||
| Line 15: | Line 15: | ||
*Good for removing all nitride on a wafer surface without a mask | *Good for removing all nitride on a wafer surface without a mask | ||
| | | | ||
* | *Anisotropic etch: vertical sidewalls | ||
|- | |- | ||
|Possible masking materials: | |Possible masking materials: | ||