Specific Process Knowledge/Lithography/Strip: Difference between revisions
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==Plasma Asher 3: Descum== | ==Plasma Asher 3: Descum== | ||
[[image:2017-03-15 13.12.45.jpg|350x350px|thumb|Plasma Asher 3: Descum is placed A-5]] | [[image:2017-03-15 13.12.45.jpg|350x350px|thumb|Plasma Asher 3: Descum is placed A-5]] | ||
The Plasma Asher 3: Descum dedicated for resist descum i.e. removal of remains resist traces after development. It has a small chamber, so you can only load one 4 inch substrate ad time or few smaller pieces. | The Plasma Asher 3: Descum dedicated for resist descum i.e. removal of remains resist traces after development. It has a small chamber, so you can only load one 4 inch substrate ad time or few smaller pieces. | ||
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The other materials have not been tested yet. | The other materials have not been tested yet. | ||
The user manual, user APV, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=423 LabManager] - '''requires login''' | |||
===Process Information=== | ===Process Information=== | ||
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==III-V Plasma Asher== | ==III-V Plasma Asher== | ||
[[Image:III-V_asher.jpg|300x300px|thumb|Plasma asher for removing resist on III-V samples: positioned in A-5]] | [[Image:III-V_asher.jpg|300x300px|thumb|Plasma asher for removing resist on III-V samples: positioned in A-5]] | ||
Diener Pico Plasma Asher for III-V materials. | Diener Pico Plasma Asher for III-V materials. | ||
The user manual and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=186 LabManager] - '''requires login''' | |||
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